Can PCB embedding expand EV range using 1200 V CoolSiC efficiency?

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PCB Embedding of 1200 V CoolSiC Chips Can Enhance EV Range Through Increased Efficiency

Infineon Technologies AG and Schweizer Electronic AG are collaborating on a technology that embeds Infineon's 1200 V CoolSiC™ chips directly onto printed circuit boards (PCBs). This integration aims to boost the efficiency of power conversion units, which in turn can increase the electric vehicle (EV) range and reduce overall system costs. The companies have already demonstrated the viability of this approach by embedding a 48 V MOSFET onto a PCB, achieving a 35 percent performance improvement.
Novel Embedding Technology

Schweizer Electronic AG's p²Pack® solution is central to this advancement, enabling power semiconductors to be directly integrated into PCBs. This method creates a low-inductance interconnection. When combined with the rapid switching capabilities inherent in Infineon's CoolSiC technology, the result is a significant uplift in the efficiency and reliability of critical power electronics components.
Enhanced Power Conversion Efficiency

The synergy between the p²Pack's low-inductance connection and the fast-switching characteristics of CoolSiC chips is crucial for improving power conversion efficiency. This enhancement is particularly beneficial for applications such as traction inverters, DC-DC converters, and on-board chargers, which are fundamental to an EV's powertrain and charging infrastructure.
Potential for Increased EV Range and Reduced Costs

By optimizing the efficiency of these power conversion systems, the overall energy consumption of an electric vehicle can be reduced. This improved efficiency directly translates to a greater driving range on a single charge. Furthermore, the direct embedding of chips onto PCBs can streamline manufacturing processes, potentially leading to a reduction in total system costs for EV manufacturers.
Technology Showcase

Infineon and Schweizer plan to exhibit their 1200 V CoolSiC chip embedding technology at PCIM Europe 2023 in Nuremberg. This demonstration will allow industry professionals to observe the practical application and benefits of this integrated power semiconductor solution.

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Can PCB embedding expand EV range using 1200 V CoolSiC efficiency?

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